The trend in the price-to-performance ratio for current laser systems, especially with respect to production of rigid PCBs, is obvious: The cost of depaneling based on the effective cutting speed has fallen to approximately one-tenth of what it was a decade ago (FIGURE 1). This dramatic shift is based on three major factors, all based on the rapid advances in laser technology. First, capex cost for laser depaneling systems has decreased to almost 30% of what it used to be a decade ago. Second, overall throughput has improved more than seven times. Finally, the operational costs for energy and maintenance have noticeably decreased.
With a full-perimeter cut, PCBs can be spaced closely together for minimal material loss, taking full advantage of the narrow kerf width of a laser tool, which is typically around 20µm vs. a 1 to 2mm router bit. This eliminates the space otherwise occupied by pre-routing lanes around each PCB on the panel. Another advantage is the variable and precise laser guidance and the narrowest possible cut to accommodate intricate geometries for optimum material utilization. Through these factors, laser systems realize savings, especially for smaller PCBs.
Unlike with milling machines, there are no significant operating expenses. The laser as a tool has no mechanical wear, and the quality of the laser is constant. There is no need to replace saw blades or router bits, which eliminates related unproductive downtime and cost to replace such parts.
To maintain a constant MTBF and minimum downtime, the preventive maintenance work on laser systems is done at longer and planned intervals and is therefore less disruptive to day-to-day productivity. Common wear parts include laser diodes, which last two to three years and typically cost in the mid four-figures.
Lasers in PCB depaneling operations eliminate dust and stress to the PCB, drastically improving production yield. Unlike traditional mechanical depaneling methods, laser depaneling machines do not generate milling dust, which can become airborne and cause quality issues anywhere in the plant, and may cause health problems for employees exposed to these airborne particulates. Lasers do not create the mechanical stresses that are imparted when using a dicing saw or router, which could jeopardize the functionality of sensitive components on the circuit board or even compromise the integrity of the board itself. In addition, laser depaneling systems create absolutely no burr and maintain a much higher tolerance of the board outline, which is particularly important for intricate-shaped circuit boards that must fit into tight spaces (e.g., wearables and sensors). PCB manufacturers achieve higher quality and better yield when laser depaneling systems are being used. These two factors together provide a significant advantage over traditional depaneling technologies.
