Off The Shelf
off the shelf typography
Machines Materials Tools Systems Software
20-nozzle SpeedStar high-speed placement head
ASM SIPLACE TX Micron
Siplace TX Micron, for advanced packaging and high-density applications, has improved 20-nozzle SpeedStar high-speed placement head that increases performance 23% to up to 96,000cph, while increasing component spectrum 37%. Handles 25, 20 and 15µm @3Σ to operate with component pitches of 50µm and place 0201m components at full speed.
ASM
Reel Smart Lite (IMS-100) and Reel Smart Pro (IMS-200) incoming material stations
Scienscope Reel Smart Lite
Reel Smart Lite (IMS-100) and Reel Smart Pro (IMS-200) incoming material stations provide integration from start to finish. IMS-100 has high-resolution barcode camera system with an image-based algorithm that reads any barcode, even with defects. Reads and stores information of four 7″ reels simultaneously. IMS-200 is updated to include automatic loader and label placement.
Scienscope
iX7059 heavy-duty inline automated x-ray inspection system
Viscom iX7059
iX7059 heavy-duty inline automated x-ray inspection system has new transport system for workpiece carriers and soldering frames. Transports assemblies with dimensions up to 500 x 500mm and up to 40kg. Performs 2-D, 2.5-D, and 3-D analyses. Resolution range of 8µm to more than 30µm, depending on configuration. Complex inspection objects are irradiated with 130kV or 160kV (optional).
Viscom
Others of Note
Echo Supply Polyimide Masking Tape
Low-ESD polyimide masking tape has width options ranging from 0.125″ to 3.0″. Is 36 yds. in length. Protects gold fingers on PCBs during wave soldering. Is made with 1-mil-thin polyimide film and 2.4 mils of anti-static silicone adhesive. Removes cleanly from PCBs and has high conformability.
Echo Supply
MacDermid Alpha HiTech CF31-4010
HiTech CF31-4010 is a one-component, high filler content, heat-curable cornerfill. Is epoxy-based material to be dispensed on the corner (corner bonding) or edges (edge bonding) of BGAs. Upon completion of curing process, cured cornerfill helps strengthen soldered, assembled component, permitting it to pass reliability tests such as drop shock, impact bend and thermal cycle. Reworkable.
MacDermid Alpha
Yxlon Cheetah, Cougar EVO
Cheetah and Cougar EVO microfocus x-ray systems are upgraded to include visualization with FF CT software as standard. Software remains compatible with volume graphics and corresponding analysis tools. ORYX 1616 high-res flat-panel detector with size of 1280 x 1280 pixels has been introduced; offers field-of-view extension of 50% compared to standard version. Work with much lower radiation dose due to sensitivity. Optional high load capacity.
Yxlon
Peters Elpespec R 5807
Elpespec R 5807 cleaning agent avoids side reactions in moisture cross-linking silicone coatings. Reportedly uses 1/3 or less concentration compared to other cleaning agents. Is said to provide efficient machine run times, minimized maintenance efforts and higher process stability. Avoids curing reactions within lacquer supply.
Peters
Indium CW-232
CW-232 flux-cored wire combines wetting speed and spread with low-spatter performance. Is activated rosin flux-cored wire developed to meet requirements of robotic and laser solder applications. Reportedly delivers additional wetting power to achieve higher throughput. Works well in hand-soldering applications. Is compatible with Pb-free and SnPb alloys and HASL, immersion silver, ENIG, and OSP surface finishes.
Indium
Saki Job Data Convert Function
Job Data Convert function enables automatic generation of data for board inspection on Saki 3D AOI systems by using component information data generated for pick-and-place machines. Reportedly reduces time to create board inspection programs by directly importing pick-and-place data to automatically generate library for PCBA inspection. Simplifies programming procedures and training for programming.
Saki Corp.