Around the World
PCDF People
The best technical conference paper of IPC Apex Expo 2021 is “Signal Integrity, Reliability, and Cost Evaluation of PCB Interlayer Crosstalk Reduction” by Sarah Czaplewski, IBM.
Craig Haywood Headshot
Elmatica named Craig Haywood senior technical advisor. He spent the past 14 years at Amphenol Invotec.
Hirose Electric USA named Shinya (Sid) Tono president and COO.
Karen McConnell Headshot
IPC inducted Karen McConnell into its Hall of Fame, given to individuals who have provided exceptional service and advancement to IPC and the electronics industry. McConnell supports numerous IPC standards development committees, including the Land Pattern Committee, Design for Excellence (DFX) Subcommittee, Generic Requirements for Digital Twin Task Group, CFX Subcommittee, Terms and Definition Committee and Electronics Documentation Committee.
Orbotech named Avi Greenberg general manager Americas and vice president sales.
PCDF Briefs
Autodesk and SnapEDA have partnered to release a new app for Fusion 360.

Bittele Electronics updated its DFM Handbook and DFA Handbook. Both detail best practices for printed circuit board fabrication and assembly.

Calumet Electronics announced its SBA certification as a HUBZone business. Calumet also won the IPC Peter Sarmanian Corporate Recognition Award for support of individuals through technical and management programs.

The Design Automation Conference and Semicon West have been rescheduled to Dec. 5-9.

The ExpressPCB Plus PCB Design Suite (ExpressSCH Plus and ExpressPCB Plus version 3.0) now includes integrated search and download for components using SnapEDA.

High data throughput and innovative thermal management may lead to a revolution in systems design that places the burden of electronics cooling on the enclosure more than on the card.

IDEX Biometrics signed an agreement with MFLEX to mass produce circuit boards for biometric payment cards.

IMI has installed a UCE (Universal) alkaline etching machine.

A new iNEMI project reports benchmark new and emerging test and measurement methodologies for 5G/mmWave materials.

L3Harris launched a 3-D printed RF circuit at the International Space Station, built with a Nano Dimension printer.

Lumentum raised its offer for Coherent to $6.9 billion, part of a three-way takeover battle for the laser firm.

Molex has received a US patent for a grid array connector system. The novel connector has conductors from cables directly terminated to a PCB.

MTS Systems announced that, based on the preliminary voting results, its shareholders have approved adoption of the previously announced merger agreement with Amphenol.

Rogers announced the release of its 2021 ESG Report, which details the company’s environmental, social and governance (ESG) strategies and commitments.

Royal Circuit Solutions installed more than $2 million worth of new printed circuit manufacturing equipment and expanded its PCB plant.

Ventec’s facility in Kirchheimbolanden, Germany, is now certified according to AS9100D (DIN EN 9100).

Zero Defects International and Skyla announced strategic plans to offer PCB frontend CAM services throughout continental Europe and the United Kingdom.