Around the World
PCDF People
David Torp Headshot
Additive Circuits Technologies appointed David Torp CEO, effective Jul. 1. He has held engineering positions at Rockwell Collins and UL, and management positions at Litton, Northrop Grumman and Kester-ITW. He served six years as site director of EMD Electronics and seven years as VP of standards and technology at IPC.
Altix appointed Maximilian Mohr DACH regional sales director.

Apple promoted Jonah Stephenson to PCB manager Audio/Home/AppleTV.

Ken Parent Headshot
Insulectro promoted Ken Parent to COO, a new position, Jason Shuppert to VP of operations, and Felix Martinez to national director of operations. Vice president of operations Jeff Mason will retire in February.
Nano Dimension hired Sean Patterson as president of Nano Dimension – Americas. He previously held leadership roles at Amazon and TTM Technologies.

TopLine named Dr. Jeffrey Sokol to its advisory team to provide guidance in aerospace and defense. He is a senior engineering specialist in hybrid microcircuits, radiation effects, and system survivability.

PCDF Briefs
Altix expanded its R&D center located at its headquarters in Normandy, France.

American Standard Circuits installed an Orbotech Ultra Dimension 800 AOI.

AT&S built the embedded component boards for an image sensor 1mm² in size and weighing about 1 gram.

BH, a South Korea board maker, will supply more than half of the rigid flexible PCBs used in Apple’s new iPhones launching later this year, reports say.

Keysight Technologies has joined Altium’s Nexar program.

Nano Dimension formed a partnership with Hensoldt to create J.A.M.E.S (Jetted Additively Manufactures Electronics Sources). The $6 million joint venture will advance development of 3-D-printed electronic components.

Peters and Atotech are developing and testing environmentally friendly technology in the field of inkjet solder masks, with the aim of providing a coordinated system of pretreatment processes and inkjet solder resists.

Stanford University researchers have invented a manufacturing technique that yields flexible, atomically thin transistors less than 100nm in length – several times smaller than previously possible.

Summit Interconnect’s Santa Clara PCB division successfully completed certification for IPC-1791, Qualified Manufacturer’s Listing (QML).

TE Connectivity has signed a definitive agreement to acquire ERNI.

Ultra Librarian has partnered with Vishay to provide free symbols, footprints, and 3-D models for download in over 30 CAD formats.

University of California, Irvine professors have been awarded a $200,000 research grant from Microsoft to investigate the sustainable development of materials in PCBs for next-generation electronic products.

Virginia Tech researchers created a new type of soft electronics, paving the way for devices that are self-healing, reconfigurable, and recyclable.

Xiamen Guangpu Electronics ordered multiple Altix Adix direct imagers.