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Samsung Develops First 12-Layer 3D-TSV Chip Packaging Technology
SEOUL – Samsung Electronics in October announced it has developed the industry’s first 12-layer 3D-TSV (through-silicon via) technology. The innovation, which is used for mass production of high-performance chips, requires pinpoint accuracy to vertically interconnect 12 DRAM chips through a three-dimensional configuration of more than 60,000 TSV holes, each of which is one-twentieth the thickness of a single strand of human hair.
Cross-section of the 8- and 12-layer TSV package.
NICE PACKAGE Cross-section of the 8- and 12-layer TSV package.

The thickness of the package (720µm) remains the same as current 8-layer high bandwidth memory-2 (HBM2) products, which is a substantial advancement in component design. This will help customers release next-generation, high-capacity products with higher performance capacity, without having to change their system configuration designs.

The 3-D packaging technology also features a shorter data transmission time between chips than existing wire-bonding technology, resulting in faster speed and lower power consumption, Samsung says.

“Packaging technology that secures all of the intricacies of ultra-performance memory is becoming tremendously important, with the wide variety of new-age applications, such as artificial intelligence and high-power computing,” said Hong-Joo Baek, executive vice president of TSP (Test & System Package) at Samsung Electronics.

“As Moore’s law scaling reaches its limit, the role of 3D-TSV technology is expected to become even more critical. We want to be at the forefront of this state-of-the-art chip packaging technology.”

Relying on its 12-layer 3D-TSV technology, Samsung will offer the highest DRAM performance for applications that are data-intensive and extremely high-speed.

Also, by increasing the number of stacked layers from eight to 12, Samsung will soon be able to mass produce 24-Gb high bandwidth memory, which provides three times the capacity of 8Gb high bandwidth memory on the market today. – MB