Printed Circuit Design & Fab Circuits Assembly December 2020 Cover
December 2020
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December 2020 • VOL. 37 • NO. 12
Printed Circuit Design and Fab Circuits Assembly logo
First Person
6
An emerging powerhouse in China.
Mike Buetow
money matters
16
Flirting with disaster.
Peter Bigelow
17
Why you should consider a certification program.
Susan Mucha
Tech Talk
18
Quieting the noise.
John Burkhert
20
Making advanced technologies affordable.
Alun Morgan
21
Scratch that etch.
Bill Hargin
23
Short and stiff.
Mark Finstad
40
Questions to ask before taking action.
John Borneman
42
01005 apertures.
Clive Ashmore
42
When through-hole connectors move.
Bob Willis
Departments
December 2020 • VOL. 37 • NO. 12
Printed Circuit Design and Fab Circuits Assembly logo
Features
24
PCEA
Now a year old, the collaborative educational group is making strides educating PCB engineers.
by Chelsey Drysdale
Up Media December 2020 cover
27
PCB Inspection
When it comes to testing in this production setting, doing only a final inspection is insufficient. Processes and tools for accurate lab analysis and defect detection of the highest reliability boards: IPC Class 3/A.
by Tim Weber, Ph.D.
32
EMS Company of the Year
2020 will be remembered as the year of Covid-19. The response was the industry’s finest hour.
by MIKE BUETOW
34
Solder Materials
The latest version of the eutectic 42Sn58Bi alloy is compared with previous SnBi solders and SAC 305 under a battery of tests, including melting behavior, solder joint formation, tensile tests at room temperature and at 75oC, and high-temperature creep.
by Morgana Ribas, Ph.D., Anil Kumar, Prathap Augustine, Pritha Choudhury, Ph.D., and Siuli Sarkar, Ph.D.
24
PCEA
Now a year old, the collaborative educational group is making strides educating PCB engineers.
by Chelsey Drysdale
Up Media December 2020 cover
27
PCB Inspection
When it comes to testing in this production setting, doing only a final inspection is insufficient. Processes and tools for accurate lab analysis and defect detection of the highest reliability boards: IPC Class 3/A.
by Tim Weber, Ph.D.
32
EMS Company of the Year
2020 will be remembered as the year of Covid-19. The response was the industry’s finest hour.
by MIKE BUETOW
34
Solder Materials
The latest version of the eutectic 42Sn58Bi alloy is compared with previous SnBi solders and SAC 305 under a battery of tests, including melting behavior, solder joint formation, tensile tests at room temperature and at 75oC, and high-temperature creep.
by Morgana Ribas, Ph.D., Anil Kumar, Prathap Augustine, Pritha Choudhury, Ph.D., and Siuli Sarkar, Ph.D.
IN the Digital Edition
Meet our leadership.
by KELLY DACK
A look back at friends and colleagues who left us in 2020.

ON PCB CHAT (pcbchat.com)

The SMTA
with Martin Anselm, Ph.D.
Electronics Data Transfer
with the IPC-2581 Consortium
EMI Simulation Tools
with Brad Griffin
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Caveat Lector
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editor-
in-chief

A New Fox in the
EMS Henhouse?

H

on Hai, better known as Foxconn, has been the largest EMS/ODM company in the world since 2005, when it catapulted Flextronics to gain the top spot. To be sure, Foxconn’s revenues then and now are enhanced by ample non-electronics manufacturing segments, but the depth and breadth of the company is by any measure staggering. In calendar 2019, it reached roughly $150 billion, a mark that is all the more impressive when you consider it doesn’t include sales from some of its largest subsidiaries, such as Innolux, Sharp, and its connector and cable units. Its quarterly revenue alone would make it the largest EMS/ODM in the world. And its annual output not only eclipses all its customers’ electronics sales, sans Apple, but also the next four largest competitors combined.

In pursuit of the almighty dollar, Foxconn is the almightiest. Nothing seems out of its reach. Its founder and erstwhile chairman ran for president of Taiwan. It also dabbled in American politics, putting a massive (if mostly empty) facility smack dab in the soy and corn fields of the district of the then-US House Speaker.

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Around the World
PCDF People
Jonas Kottman Headshot
Dyconex promoted Dr. Jonas Kottman to vice president operations. He joined the fabricator last year as manager operational excellence.
The FED trade group awarded the PCB Design Award to Thomas Blasko (CiBoard Electronic), Georg Scheuermann (TQ-Systems) and Michael Matthes (Wittenstein Cyber Motor).
John Burkhert Jr. Headshot
GoPro named John Burkhert Jr. senior PCB layout engineer. He has more than 30 years’ experience in PCB design with Velodyne, Google, Qualcomm and others.
Jacobs Technology named Russ Pringle printed circuit board designer.
L3Harris Technologies named Cameron Stouder ECAD tools and library team lead.
Lance Riley Headshot
Lone Star Circuits promoted Lance Riley to chief operating officer. He has been with Lone Star since 2017, and previously held engineering and sales executive roles with TTM and Unicircuit.
Around the World
California Startup Says It Has Answer to High-Density, Ultra-Thin Designs
SAN FRANCISCO – “Innovation starts at the bottom,” a San Francisco startup says, underpinning its belief printed circuit boards will drive the next big leap in innovation.

Thintronics, the new firm founded last year by chemist Dr. Stefan Pastine, wants to help companies make better products through “reconceptualizing PCB design.”

The materials company has ideas for lower layer count designs for devices that must be small or lightweight or both, such as mobile, IoT, wearables and autonomous systems for self-driving cars and LiDAR or drones.

Around the World
Electronic Design Tool ‘Morphs’ Interactive Objects
We’ve come a long way since the first 3-D-printed item came to us by way of an eye wash cup, to now being able to rapidly fabricate things like car parts, musical instruments, and even biological tissues and organoids.

While much of these objects can be freely designed and quickly made, the addition of electronics to embed things like sensors, chips, and tags usually requires that you design both separately, making it difficult to create items where the added functions are easily integrated with the form.

Now, a 3-D design environment from MIT’s Computer Science and Artificial Intelligence Laboratory (CSAIL) lets users iterate an object’s shape and electronic function in one cohesive space, to add existing sensors to early-stage prototypes.

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Around the World
CA People
Circuit Works named Luis Gallegos manufacturing engineer manager.
Creative Electron named Courtney Kalb client specialist.
Carolyn McAllister Headshot

Electrolube appointed Carolyn McAllister European sales manager. She has a degree in chemistry from the University of Nottingham, and spent the past six years with the company’s research and development team.

Nortech Systems named Christopher D. Jones chief financial officer and senior vice president of finance.
STI Electronics announced Emery “Graham” Goff, a student at Calhoun Community College, as recipient of the 2020/2021 Jim D. Raby Scholarship.
David Figler Headshot

Z-Axis promoted David Figler to purchasing manager. He joined the purchasing team in 2019, and has more than 20 years’ experience in electronics purchasing and commodity management with Caldwell Manufacturing Company, Alstom, ITT Gould Pumps and Pfaudler.

Zollner promoted Erick Fabian to supply chain designer.
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Around the World
CA Briefs
ABAJ Group is setting up a TV and AC manufacturing facility near Mehsana, India.

AIM Solder opened a 12,000 sq. ft. ISO 9001-certified solder manufacturing facility in Malaysia.

Aimtron purchased an Austin American Technology X30 stencil cleaner, its second.

Apple has reportedly suspended new business with Pegatron after discovering labor violations at a student workers’ program.

In the two months since Huawei lost access to American technology, Japanese makers of electronic parts have enjoyed a fresh wave of orders from other smartphone manufacturers seeking to claim market share now up for grabs.

CalcuQuote has partnered with Rochester Electronics to build a new integration that offers up-to-date information through the CalcuQuote platform.

Cogiscan named AES to handle sales and service throughout Vietnam.

Around the World
Victory Giant Technology Plans Second ‘Smart’ PCB Plant
SHANGHAI – Victory Giant Technology will begin work on a new smart manufacturing factory here in the first quarter 2021, the printed circuit fabricator’s second such facility.

The new plant is expected to be operational by the second quarter 2022.

The plant is a larger version of VGT’s high-volume Industry 4.0 factory, which opened last year. The site relies on AGVs and other automation, plus VGT developed intelligent ERP software and real-time product metrology to reduce labor and shorten production cycle time. (MB)

Around the World
Ticer to Buy Materion LAC Assets, Head Off Supply Break

CHANDLER, AZ – Ticer Technologies announced an agreement to acquire certain manufacturing assets from Materion’s Large Area Coatings division, effective Jan. 1.

The deal will help Ticer avoid a potential supply disruption, the company said.

The companies did not disclose financial terms.

Ticer, which makes thin film embedded resistor foils, will acquire LAC’s vacuum deposition/sputtering production equipment, which will remain at the firm’s facility in Windsor, CT, as well as certain staff. Processes, equipment and raw materials will remain the same during the transition process, the companies said.

“This is a significant improvement in capacity and supply leadership long sought by Ticer,” said David Burgess, president, Ticer. “We believe our global customers will benefit from the flexibility and supply chain control afforded by this change.”

Ticer had previously announced a potential supply chain disruption due to the planned divestiture of Materion’s LAC division. The acquisition will obviate that potential disruption and make product requalification unnecessary. (MB)

Around the World
BAE Breaks Ground on Massive Electronics Factory
CEDAR RAPIDS, IA – BAE Systems is investing more than $100 million to build a state-of-the-art manufacturing and R&D facility here. The center includes a 278,000 sq. ft. factory and research and development center located on a 32-acre site in Cedar Rapids.

Besides the large factory, the site will include several hundred offices, workstations, and flexible workspaces, and classified and unclassified labs. The building was designed for growth, with the ability to add 50,000 sq. ft. of additional space in the future.

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Around the World
New Study Lays Groundwork for US Semi Fab Resurgence
WASHINGTON – A new report finds the US government has a strategic opportunity to reverse the decades-long trajectory of declining chip manufacturing in America, strengthen national security, make domestic supply chains more resilient, and make the country one of the most attractive places in the world to produce semiconductors.

The report, issued in September by the Semiconductor Industry Association and the Boston Consulting Group, says the US share of the global semiconductor fabrication industry has dropped to 12%, from 37% in 1990. Moreover, just 6% of new capacity is earmarked for the US, the authors say. In contrast, China will add nearly 40% of new capacity, making it the largest semiconductor manufacturer in the world.

Market Watch
EDITED by CHELSEY DRYSDALE
Computers Boot Up

Trends in the U.S. electronics equipment market (shipments only).

%CHANGE
JUL.
AUG.
SEP.
YTD%
Computers and electronics products
4.1
0.5
1.2
2.9
Computers
-2.8
-0.7
3.3
-10.1
Storage devices
2.9
-1.3
-7.4
34.5
Other peripheral equipment
23.7
3.0
-9.2
8.6
Nondefense communications equipment
9.2
1.7
2.8
9.4
Defense communications equipment
-3.8
6.2
-5.1
4.0
A/V equipment
10.7
-3.0
2.8
-9.3
Components1
4.5
0.7
-0.7
9.5
Nondefense search and navigation equipment
1.2
-0.8
-1.1
-5.9
Defense search and navigation equipment
1.7
-3.2
2.6
2.5
Medical, measurement and control
1.2
2.8
0.5
-1.9
rRevised. *Preliminary. 1Includes semiconductors. Seasonally adjusted. Source: U.S. Department of Commerce Census Bureau, Nov. 3, 2020
ROI
Preparing Your Company for Disaster
Businesses can’t plan for everything, but with the right prep they can adapt.
December is finally here. Mercy knows it seems to have taken forever to bring this most unusual year to a close. I keep pondering the question customers inevitably ask during a supplier audit: What contingencies are in place for “unforeseen and unthinkable” disasters and events? If anyone had asked me a couple years ago to come up with a plan to deal with a global pandemic I would have thought them to be crazy for asking. And yet, that was 2020!

The one takeaway from this crazy year is you can never plan for everything. Paradoxically, good planning makes it easier to deal with the unimaginable.

Focus on BUSINESS
Opportunity Knocks at the Doors of Continuous Learners
Why you should consider a certification program.
When I look back on my career and consider the key ingredient to my success, I’d say whenever opportunity knocked, I had the right skill set to walk through the door. I was fortunate that my first electronics manufacturing services (EMS) employer had both a tuition refund program that paid for my master’s degree in management and an internal management training program. That started me on a path of continuous learning that included multiple certification programs and other training programs. And, as advancement opportunities came up, I had the right qualifications and a results-focused track record.

Company-sponsored educational resources are more limited today. That said, technology has made it possible and convenient to engage in focused continuous learning opportunities. IPC’s Certified Electronics Program Manager (CEPM) training and certification program is a good example. What once required multiple trips to training locations and a solid week of classroom time can now be done via computer either in live sessions or through reviews of class recordings. The program was redesigned to an online format in 2017 and now is a six-week program with two two-hour classes per week, providing overviews of program management, sales, cost accounting, materials management, contracts, production planning, quality and leadership. Students are assigned to teams that complete a case study each week related to the concepts presented. A variety of online exercises reinforce key concepts. The goal is to ensure participants are provided a common framework of knowledge and the opportunity to interact with peers to discuss best practices. Information on the program and upcoming dates is available here: https://training.ipc.org/product/certified-electronics-program-manager-cepm-program .

designer’s notebook
Taming Electromagnetic Interference on a PCB
What’s all this noise? Look beyond the wires and connectors to think inside the box.
You can’t always hear it, feel it or see it, but every active electronic device radiates some kind of energy as it operates. For the most part, that’s the point. We want to hear the music; we want to feel the air conditioning or see the light. Those are the good things.

Meanwhile, we don’t want side effects: static on the radio, compressor noise from the AC or that annoying 60Hz hum from the light fixture bleeding over to my new bass amp. It’s these things we try our best to design out of the products we build.

We can adjust the tuner on the radio, and we can install the central AC unit away from the windows. I ordered a noise suppressor and plugged it into a socket where there’s no dimmer switches or high current motors plugged in. Then the amplifier and pedal board power cords were routed into the special apparatus, and I no longer get a wave of white noise when this MacBook Pro searches for a WiFi signal.

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Material Gains
The 5G Rollout Should be Flying High – Literally
Affordable and accessible technologies are the key to global progress.
My smartphone does everything so well I hardly use my tablet or laptop at all. It contains all the apps I need to use every day, is always with me and always connected, and the clarity of the screen makes it a pleasure to handle the majority of computing tasks on this device. I am convinced improvements in display technologies have helped the smartphone become the go-to device for a vast number of daily activities.

To support the best possible experiences in video, photography and gaming, new display technologies continue to emerge to provide seamless, immersive viewing. OLED displays are dominating the smartphone and flat-panel television markets, bringing attributes such as conformability and optical performance, including high contrast ratio with the ability to render true black, which conventional LCDs cannot manage.

Material matters
Etch Effects Explained
The impedance implications of the trapezoidal trace.
Until recently I thought those who believed in rectangular traces were about as common as those who believe in square waves and a flat earth. Recently, though, I came to realize it’s not as clear as I thought, not only for newbies but in general. Over the past 25 years, I’ve acquired a good number of books on PCB design and signal integrity, and you wouldn’t know from reading most of the industry literature that traces were anything but rectangular. Interesting, right?

If you’ve read previous “Material Matters” columns, you may recognize the following cross-section from our Z-solver software. Among other things, it shows that the base of a trace, facing the core dielectric, is wider than the side of the trace that faces the prepreg. As such, the trace trapezoids face both up and down in a multilayer stackup. There’s no relationship to the layer number or whether the trace is on the top or bottom half of the board. For this reason, some including me – but not everyone – avoid using terms like “top” or “bottom” with regard to trapezoidal traces.

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The Flexperts
What Is the Shortest Flex Length Between Rigid Areas?
The shorter the length, the stiffer the flex.
I have an application requiring two rigid PCBs mounted at 90° to each other. I would like to connect them with a flex zone and use rigid-flex construction. How close can rigid areas be to each other; i.e., what is the shortest flex length between rigid areas?

Most manufacturers can form 0.250″ flex sections with no issues, and many can get down to less than half that. There are manufacturing and final-use implications of short flex sections between rigid areas on rigid-flex circuitry. The manufacturing issues affect cost, and the final-use issues could cause premature failure if the specified flex length is too small.

PCEA
A New Industry Community Explodes Online During a Global Pandemic
A collaborative educational group formed in January and adapted virtually to bring the industry together. by CHELSEY DRYSDALE
A year ago, after IPC dissolved the Designers Council, its board members formed the Printed Circuit Engineering Association (PCEA) to continue their pursuit to collaborate, inspire, and educate the PCB design and engineering community.

The PCEA’s mission is to promote the printed circuit engineering profession by encouraging and facilitating the exchange of information and the integration of new design concepts through communications, seminars, and workshops. Its efforts are buttressed by a network of regional chapters and the support of sponsors, including several CAD companies and other firms.

The PCEA has a growing membership of more than 1,000 members, with existing chapters in Phoenix, Orange County (CA), San Diego, Silicon Valley, Ontario (Canada), Minneapolis-St. Paul, Monterrey (Mexico), Nogales (Mexico), Research Triangle Park, and Seattle. Chapters planned for the near future include Columbus-Cincinnati-Dayton; Grand Rapids, MI; Illinois-Wisconsin; New Hampshire-Massachusetts; Albuquerque; Houston; Dallas; and Austin. The PCEA hopes to open another Canadian chapter soon.

The DIGITAL Route
PCEA and Women Industry Leaders
Some of our favorite subject-matter experts explain what motivates them.
In this month’s column I introduce a few of our inspiring women PCEA leaders. Next, PCEA chairman Stephen Chavez offers his take on the importance of diversity in a collective organization. As always, I include our list of professional development opportunities and events. Last, I tease some upcoming coverage on one of the PCEA’s educational networking events.
PCEA Updates
One of the most inspiring events I’ve had the opportunity to cover over the past decade was an early morning Women in Electronics at IPC Apex Expo. This event brings together women in the electronics industry to join their colleagues across the supply chain to network, share ideas, and discuss career experiences. It is an opportunity for women in the industry to learn from and inspire one another.
PCB INspection
Accurate Microsectioning for High-Volume Production
Processes and tools for accurate lab analysis and defect detection.
by TIM WEBER, PH.D.
Electronic sample preparation is a complex process that goes beyond merely lopping a piece off a PCB for inspection. This process involves several, exacting preparation stages.

The process designs each step to specifically adapt to the inspected device’s design, materials, and fabrication technology. Performing any of the preparation stages incorrectly can result in spurious features, artifacts and great potential for both Type I and Type II error.

The process starts with PCB manufacturers designing test coupon segments into each of their products. This function enables panel testing without wasting the actual production board. To confirm the lab has met product specifications, they separate the coupon from each panel.

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EMS Company of the Year
Courage in the Face of Covid
As a pandemic crashed the industry, EMS companies responded with vigor and speed. by MIKE BUETOW
2020 will be remembered as the year of Covid-19. It hit China first, spurring a national response that included the shutdown of all industrial activities, including manufacturing.

That’s no small matter. China produces some 90% of all electronics worldwide. In anticipation of the Chinese New Year, most companies outside China had increased their inventories of raw materials, so the impact on the supply chain wasn’t immediately felt. As buffer stocks dwindled, producers in the US and Europe were socked with virus-related shutdowns. Meanwhile, China came back online. So, while materials weren’t always where manufacturers needed them, even critical components generally were accessible in relatively short order.

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Solder Materials
High-Reliability, Fourth-Generation Low-Temperature Solder Alloys
Results of melting behavior, solder joint formation, tensile strength and high-temperature creep tests. by MORGANA RIBAS, PH.D., ANIL KUMAR, PRATHAP AUGUSTINE, PRITHA CHOUDHURY, PH.D., AND SIULI SARKAR, PH.D.
There has always been a latent interest in low-temperature solders, as they can 1) potentially reduce material cost by enabling use of cheaper PCBs and components due to the lower processing temperature, 2) promote long-term reliability by reducing exposure to thermal excursion, 3) reduce labor cost, 4) reduce energy cost, and 5) reduce dynamic warpage in sensitive components.

SnPb alloys have been historically used for making joints. In the case of electronics, eutectic 63/37 SnPb was a very good choice, as solder joints could be soldered at relatively low temperatures, considering its melting point at 183oC. Eutectic SnPb also produced solder joints with very good mechanical reliability. The transition to lead-free was mostly a matter of regulatory compliance, and in the early 2000s various lead-free alloys were considered substitutes for eutectic SnPb, including the eutectic 42Sn58Bi alloy.

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RETROSPECTIVE
In Memoriam
A look back at friends and colleagues who left us in 2020.
Frances “Fran” Allen, 88, computing pioneer, first female IBM Fellow, Turing Award winner.

Preston Averette, 71, founder and owner of Photo Chemical Systems.

Danny Carr, 65, CAM software engineer and founder of Everything PCB.

Chen Sheng-wei (陳昇瑋), 44, Taiwan Artificial Intelligence Academy CEO who helped bring AI to PCB CAD.

Arvelee Church, 84, Martin-Marietta Aerospace soldering instructor.

Julian Coates, 62, marketing executive with Valor.

Karl Dietz, Ph.D., PCB materials expert at DuPont and prolific author.

Undisclosed Foxconn worker.

Patty A. Houston, 64, circuit board department worker, General Electric Medical Systems.

getting lean
Evaluating the Risk and Reward of Statistical Analysis
Questions to ask before action is taken.
Most who perform statistical analyses that guide organizations to solve problems do not have advanced degrees in statistics. We’ve attended classes at university, engaged in varying levels of Six Sigma training, or conducted self-study.

But I think it is safe to say we all have learned that statistically evaluating a set of data is complicated and rife with uncertainty. We choose among many possible statistical tools, and numbers “pop” out telling us if our hypothesis is correct. From those data, we proceed to either take an action or not take an action, depending on the statistical results.

Yet how many finish an analysis and wonder what if it is wrong? Did I have enough data? Did I choose the proper statistical tool? Do I even know the proper statistical tool? Arghh! (I suspect doctors of statistical science also have “arghh” moments.

screen printing
Successful Printing, Even When the Walls Close In
For 01005 parts, some apertures are better than others.
Continuous reduction in component size has been at the forefront of electronics product innovation, assembly process development and the industry conversation for years. Readers will no doubt recall the papers presented, tools developed, and processes modified to accommodate the “coming soon” metric 03015 and 0201 components. That preparation is essential. In my opinion, however, it is more likely than not that widespread use of these ultra-small chips is far in the future; it will come, but probably not in the next generation.

Another reality presents, perhaps, a more immediate challenge: increasing component density beyond current norms. Realistically, for next-generation mobile phones and wearables, the primary consumers of the most miniaturized components, board designs will continue to incorporate the 01005 chip (metric 0402). There are a gracious plenty of reasons for this, not the least of which are cost and component availability. The challenge for product designers is how to get the most function from chips that may be larger than they would prefer. What’s the solution? Squeeze the 01005s closer together, of course!

defect of the month
Component Pin Float Issues
When through-hole connectors move during soldering, damage to the nozzle ensues.
This month we look at through-hole connectors and component pin float. All connector pins should be held in place by the body molding and not move during soldering. The connector should not be used outside of its specification. Suppliers typically define the temperature and time the pins and body of the part are exposed to a specific peak temperature. It is the designer’s job to ensure the correct parts are defined for the process. It is the purchasing department’s job to ensure the correct parts are ordered.

In the images shown, the pins in the connector have floated down. This happens easily during soldering or rework. In an automated process, if the pins drop down 1 to 2mm below the board in selective or wave soldering, they can cause damage. Pins can contact the solder nozzle or wave former, which will jam the machine. Using low-temperature solder with a lower specification connector will work fine, but consider the rework temperatures if parts must be removed.

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Off The Shelf
off the shelf typography
Machines Materials Tools Systems Software
Clarity 3D Transient Solver system-level simulation
Cadence Clarity 3D Transient Solver
Clarity 3D Transient Solver system-level simulation solves EMI system design issues up to 10x faster than legacy 3-D field solvers. Parallel matrix solver technology reportedly handles workload levels that previously required anechoic test chambers to test prototypes for EMC compliance. Performs large-scale simulations when designing interconnects for PCBs, IC packages, and SoIC designs within mechanical enclosure.
Cadence
PathWave advanced design system software
Keysight PathWave 2021
PathWave advanced design system software 2021 now comes with design cloud simulation services. Reduces simulation time, increases simulation test coverage and provides access to scalable hardware resources in the cloud. Can perform compute-intense electromagnetic simulations with on-premise clusters or scalable cloud hardware and tackle large electromagnetic simulations. Runs signal acquisition and measurement in parallel, rather than in series.
Keysight Technologies
MacuSpec VF-TH 300 VF-TH series electroplating used in mSAP HDI manufacturing
MacDermid Alpha MacuSpec VF-TH 300
MacuSpec VF-TH 300 VF-TH series electroplating is for processes used in mSAP HDI manufacturing. Is a single-step pattern plating process for simultaneous copper filling of blind microvias and PTHs, while providing controlled trace profiles in mSAP applications. Electrolytic copper layer is naturally resistant to V-pitting.
MacDermid Alpha
Off The Shelf
off the shelf typography
Machines Materials Tools Systems Software
X7056-II BO inline x-ray optically and radiographically inspecting bond wires
Viscom X7056-II BO
X7056-II BO inline x-ray optically and radiographically inspects bond wires, including enclosed ones, and concealed solder joints beneath chips. Inspects tapes and wires, and soldering quality of dies. Detects opens, concealed connection points, and surface soldering voids. Library contains inspection patterns for die bonds, ball-wedge, wedge-wedge and security bonds.
Viscom
SR100E parts replenishment rack
Inovaxe SR100E
SR100E parts replenishment rack operates on the production line next to pick-and-place machines to facilitate efficient feeder replenishment. Handles 7″, 10″, 13″, and 15″ reels of various widths, along with a work surface for various tasks like tape splicing and feeder loading. Can store splicing tools and materials and install splicing fixtures.
Inovaxe
V310i 3-D SPI with warpage compensation, auto pads and component learning
Vitrox V310i
V310i 3-D SPI has warpage compensation, auto pads and component learning. Handles boards weighing up to 7kg and 510mm x 510mm in size in single-lane mode or 460mm x 325mm in dual lane.
ViTrox Technologies
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Technical Abstracts
In Case You Missed It
Component Technology
“N-Polar GaN-on-Sapphire Deep Recess HEMTs With High W-Band Power Density”

Authors: Brian Romanczyk, Weiyi Li, Matthew Guidry, Nipuram Hatui, Athith Krishna, Christian Wurm, Stacia Keller, and Umesh K. Mishra.

Abstract: This work presents recent progress in the W-band (94GHz) power performance of N-polar GaN deep recess HEMTs grown on sapphire substrates. While SiC has been the substrate of choice to achieve the highest level of performance, sapphire substrates are a lower cost alternative. The authors show that N-polar GaN deep recess HEMTs grown on sapphire match the power performance of a device on SiC up to 14V with 5.1W/mm of output power density. At 16V the device on sapphire starts to suffer from thermal effects but still demonstrated 5.5W/mm with an associated 20.6% power-added efficiency. This work also examines the impact of encapsulating the device in a low dielectric constant film often used for the implementation of an RF wiring environment. Such a device could be critical to efficiently pushing 6G’s terahertz-frequency signals out of the antennas of future smartphones and other connected devices. (IEEE Electron Device Letters, vol. 41, no. 11, November 2020, https://ieeexplore.ieee.org/document/9187650)

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Pulsonix PCB
Design Software
PCB design done right
Maximum Productivity in Minimal Time
With a modern, easy-to-use interface and advanced capabilities to automate your layout process, Pulsonix can be the key to a critical reduction in your design time. That’s PCB design done right!
Pulsonix PCB Design Software
Advanced PCB Design Features
  • Intuitive placement and routing
  • Dynamic copper pour
  • Full rules engine for automatic DRC
  • High-speed design rules
  • Heads-up display length matching
  • Rigid-Flex, embedded components, and chip-on-board
  • Revision control and PLM integration
Try Pulsonix yourself at pulsonix.com/trial
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