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buetow
in-chief
ow many greenfield plants do you think have been built in the US in the past 10 years?
I can think of three, and two of them were designed and built by the same person and corporate parent. There’s Whelen Engineering, the OEM that opened a captive shop in 2015. The brains behind that, Alex Stępiński, then designed and built GreenSource Fabrication, which launched in 2018. And perhaps we can count TTM’s new plant in Chippewa Falls, built in a converted 20-year-old, 40,000-sq. ft. warehouse and officially opened last winter.
Now we can add one more to the list. More surprising, an EMS company built it.
Last month Benchmark Electronics opened the doors to its 122,000 sq. ft. state-of-the-art factory in Phoenix. The company, the fifth largest EMS in the US and 18th in the world according to the CIRCUITS ASSEMBLY Top 50, is known for putting components on boards, not making the substrates themselves. The new venture is a leap of faith, buoyed by the desire to control the product development from end to end.
Lenthor Engineering named Dale Smith chief technology officer. He has years of hands-on experience in advanced rigid-flex and flex processing technology and techniques, the past five at DuPont.
Mike Flatt, former chairman of Continental Circuits, has passed away at 81.

National Instruments signed a definitive agreement to acquire OptimalPlus, a global data analytics software company, in a deal valued at $365 million.
Price Circuits installed a Miva 2025L Di Trio LDI.
Production has begun at Schweizer Electronic’s new EUR100 million ($113.4 million) printed circuit board plant in Jiangsu province. The Jintan plant, located about 200km east of Shanghai, has a high level of machine integration and automation, the firm said. Once complete, the Schramberg, Germany-based fabricator’s new site will have a capacity of over 7,000 sq. m. per day, roughly five times that of the German plant.




“Military sensor solutions require performance and reliability levels far above those of commercial components,” said Thomas Müller, CEO, Hensoldt. “To have high-density components quickly available with reduced effort by means of 3-D printing gives us a competitive edge in the development process of such high-end electronic systems.”
“Nano Dimension’s relationship with Hensoldt is the type of partnership with customers we are striving for,” said Yoav Stern, president and CEO, Nano Dimension. “Working together and learning from Hensoldt led us to reach a first-of-its-kind in-depth knowledge of polymer materials applications. Additionally, it guided us in the development of Hi-PEDs (high-performance electronic devices) that create competitive edges by enabling unique implementations with shortest time to market.”
Hensoldt has used Nano Dimension’s DragonFly 3-D printing system since 2016. Last year, Hensoldt implemented DragonFly Lights-Out Digital Manufacturing printing technology. (CD)
The latest update to Altium 365 now allows collaboration among PCB designers, mechanical designers, part suppliers and manufacturers. And Altium 365 provides a built-in co-designer capability that provides native integration with a trio of MCAD platforms: PTC Creo, Dassault SolidWorks and Autodesk Inventor.
According to Leigh Gawne, chief software architect, 365 provides a “full-on collaboration in that actual PCBs and components can be changed. The MCAD user can place and move an electrical part, define the PCB, and push the (update) to the PCB engineer.”
“ECAD has really been confined to a desktop. With Altium 365, we are taking it off the desktop. Anyone with a web browser is now able to view and interact and collaborate on these designs. For those who want to open a schematic and cross-probe to a net on a PCB or a component in a 3-D rendering of the board, it doesn’t require this heavyweight software to be installed. For people who want to consume and inspect and interact, this is possible anywhere, on any device, just through a browser.”
Ability Tec has relocated to a new purpose-built EMS facility in Burk, UK.
Actia Electronics installed a Takaya APT-1600FD-A flying probe tester.
ALLPCB opened a self-operated SMT factory in Guangde, Anhui Province, China.
Apple is examining a proposal to shift nearly one-fifth of its production capacity from China to India, ramp up its local manufacturing capabilities through its contract manufacturers and achieve $40 billion worth of production over the next five years, The Economic Times reported.
Big Ass Fans installed a Hentec Industries / RPS Automation Vector 300 selective soldering machine, its third.
Panasonic said that next year it will move its Thai-based production of white goods to Vietnam, laying off some 800 workers.
Phoenix Systems installed a Unicomp AX-8200HR x-ray machine.
Pillarhouse appointed Performance Technologies Group to spearhead sales in Virginia, West Virginia, Maryland, and Washington, DC.
Rocket EMS added conformal coating services.
ODB++Process data exchange format, previously known as OPM, helps enable the open exchange of process engineering information between disparate machines, software vendors, and standalone processes.
This free data exchange format helps users transfer machine programs from one machine type to another, such as a target machine from a different vendor or a machine on a different platform. ODB++Process provides the open exchange of process engineering information, which then converts the data for immediate use on any production machine or workstation.
“By using a single assembly format file output like ODB++Process, which standardizes machine package libraries with vShapes across the entire production line, Koh Young is able to minimize program variations between machines like inspection and mounters,” said JD Shin, chief sales officer for Koh Young. “The enhanced approach to programming reduces human error and variation and significantly reduces the NPI programming cycle time. What’s more, the single file assembly format output like ODB++Process is machine agnostic and easily enables moving production assembly data and process requirements between lines – and more importantly factories across the world.”
MacDermid Alpha Electronics Solutions, Henkel and Heraeus developed the Pb-free solder alloy known as Innolot and Loctite 90ISC for harsh environment electronics applications. The alloy is designed to tolerate the demands of high-temperature applications, while being solderable at standard Pb-free process temperatures.
“The issuing of this patent is of strategic and commercial importance,” said Tom Hunsinger, vice president of marketing, MacDermid Alpha Electronics Solutions. “Coupled with patent protection in Europe and Japan, this will help drive new business opportunities not only in automotive but in other markets with harsh environment challenges.” (CD)
UL Supplier Cyber Trust Level analyzes suppliers’ security practices across multiple trust categories, resulting in a documented supplier trust level rating. This rating demonstrates the trustworthiness of a supplier’s security practices across the software and hardware development lifecycle, hosted systems, information management systems and their third-party management.
UL Supplier Cyber Trust Level assessment enables a holistic view of supplier’s security posture, while providing a consistent evaluation for organizations of the cybersecurity posture from supplier to supplier.
“Cybersecurity for connected technologies is a major risk that impacts manufacturers, service providers, suppliers and end product ecosystems,” said Isabelle Noblanc, global vice president and general manager, Identity Management and Security division, UL. “A supplier’s security-oriented culture, security processes and practices and secure R&D environments are all critical when validating supplier security. UL understands this significance and continues to help organizations with IoT cybersecurity offerings that address end products, ecosystems and now – with the launch of our Supplier Cyber Trust Level – supply chains.”
The deal is expected to close by the end of August, subject to a material definitive agreement and SigmaTron’s raising of $7.5 million in additional capital that it projects will be needed for the expanded operations.
Upon completion, Wagz will be a standalone operation of SigmaTron.
For the past two years Wagz has outsourced part of its product portfolio to SigmaTron.
“Over the last two years, we have become immersed in the pet tech market with Wagz as our customer,” said Gary R. Fairhead, president and CEO, SigmaTron. “We have been impressed with the growth of the pet sector, and data show it is practically recession-proof. Recent reports indicate pet ownership during Covid-19 has increased, accelerating what was already a very strong market. Wagz would benefit from our ability to provide world-class manufacturing services through our global footprint and supply chain, and SigmaTron would benefit from new high-margin recurring revenue.” (CD)
Trends in the U.S. electronics equipment market (shipments only).
Each industry and company has issues to work through, whether it is bringing back furloughed or terminated staff, or just figuring out whether and how to integrate work-from-home into a long-term employment scenario. In all cases, employee reentry must be dealt with quickly to rebuild the sense of corporate community and possibly build an even greater sense of team.
People by nature want to be with other people. Collaboration requires a good smattering of face-to-face time. While Zoom, GoToMeeting and WebEx will continue to assume a bigger place in the business interaction mix, long-term success requires people being together at least some of the time. While we will reluctantly continue social distancing and wearing face masks at times, corporate management’s number one challenge is how to bring the team together and get back to a more normal work environment.
Those responsible for corporate procurement need to understand supplier diversification is the key to remaining competitive in this challenging economy. Yet, many OEMs and EMS companies have invested too much of their annual PCB spend with only one vendor. That could prove to be a costly mistake.
I understand and appreciate vendor loyalty, but are you leveraging your vendor, or are you being leveraged by your vendor?
The truth is companies that stick with this one-vendor approach will have a harder time remaining competitive in the post-pandemic world. “We have used this vendor for years” is not a viable strategy.
The basic framework is built around two disciplines: mechanical and electrical engineering. The two main features are the components and, of course, the board. An intelligent set of library parts is essential to getting the placement off to a good start. Over the years, schematic capture has shifted from the PCB designer’s hands to those of the EE.
The schematic and component libraries are often outsourced or created by an in-house specialist. The goal in the larger outfits is to allow the PCB designer to focus on placement and routing. Startups will put more hats on your head. Either way, our time is a precious commodity not to be wasted.
Fortunately, instances of such extreme technophobia have been few. It seems every new technology wins vocal detractors, however beneficial its effect on peoples’ lives. In recent years, our industry has had to deal with claims about grisly health risks associated with mobile phones, the effects of “wind turbine syndrome,” and the evil propagated by 5G.
Advanced technologies will hold the key to our defense against Covid-19. We will need the knowhow of pharmaceutical labs to create an effective and practicable vaccine, and engineering skills to develop new respirator designs better adapted to the needs of coronavirus patients than are conventional ventilators or CPAP devices. Moreover, effective virucides will be needed to enhance cleaning in places such as hospitals, waiting rooms, factories, warehouses, public transport vehicles, and aircraft. Irradiating at-risk areas using germicidal UV-C lamps could be an option and could easily be automated using mobile robots.
Crosstalk is unwanted noise generated between signals. It occurs when two or more nets on a PCB are coupled to each other electromagnetically, (even though conductively they are not connected at all). Such coupling can arise any time two nets run next to each other for any significant length. When a signal is driven on one of the lines, the electric and magnetic fields it generates cause an unexpected signal to also appear on the nearby line, as shown in FIGURE 1.
A number of factors combine to create an unwanted crosstalk signal: the length over which the traces are coupled, the distance between the traces, their positions in the PCB stackup, what driver ICs are used on both the “aggressor” and the “victim” lines, whether the lines are terminated, and so forth.
This month, I share updates on the PCEA website and reports on some inspiring collaboration taking place between the PCEA and a well-known industry organization that appears to have a high potential for synergy for all engaged.
I’m always happy to mention that PCEA Chairman Steph Chavez has prepared a message as well, where he provides an overview of his take on adapting to the new normal by doing more with less.
Last, we are not able to provide any reports on local chapter activities due to continued social distancing requirements. However, we will share our most updated list of professional development opportunities and events, which we hope you might find useful. As always, stay tuned for more updates.
Words ending in “ation” can affect our mission. Stay positive!
Throughout the week, I lap up a lot of evening news. Like you, I’m tired of so many negative news reports about “frustration in the nation regarding the presentation of some information regarding an observation that it is a violation to meet together in an organization without six feet of separation until after there is an indication of a successful vaccination declaration.” In effect, I’ve become oversensitized to words ending in “ation.” They cause me to itch. But a brief conversation I had with PCEA Chairman Steph Chavez quickly desensitized me to these “ation” words.
Speculation abounds over what a designer should do when making the stackup and design rules for a four-layer PCB. Much of this speculation or rules-of-thumb came about when those not familiar with the reasons for arranging the layers in a four-layer PCB tried to explain what they saw or heard. This article explains how four-layer PCBs came into existence and guides readers on how to create a set of design rules and stackup that results in a solid, functional design with minimum constraints.
Early logic designs were done with two layers. Power was distributed using traces to connect all the power and ground pins to the power supply rails. Logic devices were packaged in 14- and 16-lead dual inline packages (DIPs). FIGURE 1 is an example of such a two-layer logic design. Logic speeds were slow enough that connecting power with traces instead of planes was “good enough.” Figure 1 is a design the author did using Bishop Graphics tape to create the artwork in the early 1970s.
As logic speeds (clock rates and rise times) became faster, it was not possible to achieve stable logic operation with such a high inductance power distribution network. To go up the speed curve, it was necessary to add two power planes: one for Vdd and one for ground. For the planes to do their job, they needed to be intact. As a result, these planes were placed in the middle of the PCB, yielding a stackup like that shown in FIGURE 2. (If the planes were on the outer layers, they would be interrupted by component mounting structures and cease to function properly as planes.) Until recently, virtually all PC motherboards and motherboards for gaming consoles were built to this stackup.
Periodically, questions about differential trace design rules come up. There is always confusion over whether it is necessary to route differential traces close together, whether a plane needs to be underneath differential traces, or whether to consider differential impedance design rules with differential traces. In one sense, the answers to these questions are difficult, but in another sense they are simple. In fact, if we are not concerned about signal integrity issues, there are no design rules at all. Here is my way of trying to clarify things.
First, what are differential signals, and why are they different? FIGURE 1 illustrates a single (sometimes referred to as a single-ended) trace connecting a driver and a receiver (a) and a differential trace pair (b). Let’s say the signal amplitude (with respect to the reference voltage) in Figure 1a is V = +1. In Figure 1b, there are two signals, V+ = +1 and V- = -1. What the receiver in Figure 2 sees is the difference between these two signals, V+ – V- = +1 – (-1) = +2. The first, and most obvious, difference between the two configurations is that differential signals offer twice the signal level to the receiver. Usually, this translates into twice the signal-to-noise (S/N) level. This is a clear advantage over the single-ended case, and is the primary advantage of differential signals, especially when signal levels are low (as with many sensors).
To realize the benefits and potential of the Industrial Internet of Things (IIoT) or move toward Industry 4.0, the industry must overcome several challenges ranging from securing the factory equipment used to produce secure IoT-ready products to defining the cobotic dialogue so collaboration between humans and machines can be used to drive innovation, while providing efficiencies with minimal workforce displacement in this industry and those of its customers.
Aside from technical issues, ethical, geopolitical, economic and regulatory issues may affect the current and future state of the industry.
Hackers have already wreaked havoc by infiltrating connected IoT devices. Paradoxically, they usually aren’t targeting device owners, who often remain unaware of security breaches. Instead, the hackers may simply use IoT devices as starting points for attacks directed against another target. For instance, the 2016 Mirai attack, which used IoT devices to launch a distributed denial of services against gaming servers, ended up attacking the Internet infrastructure, causing shutdowns across Europe and North America that resulted in significant economic damage. As the IoT base continues to show double-digit growth rates, security is simultaneously a major industry challenge and a significant opportunity.
by CLINT HANSON
The electronics manufacturing services (EMS) facility was divided into five areas, each headed by a supervisor with direct responsibility for the team in that area. This put resource allocation in the hands of the people who work with those resources. Instead of dedicating space and team members to specific customers, each supervisor now has the flexibility to move their team around based on that day’s demand. They can also request additional training for any team member if they feel additional skills are necessary. Additionally, one supervisor was assigned as an assistant to the production manager. A production manager has finite bandwidth. The assignment of a roving supervisor to address day-to-day challenges helps ensure tactical issues don’t sidetrack the production manager from focusing on more strategic issues.
For companies that develop and sell MES, developing proprietary machine interfaces is a major resource, cost and time expense. Doing so involves constant updates and attempts to work with companies that often perceive MES vendors as competitors and are not willing to share interface information and data. Electronics manufacturers evaluate machines more and more on the type of communication interface they provide and their additional cost, and often buy machines from vendors that do not charge extra for communication interfaces. A standard interface always has been needed. Attempts to create one failed because of shortsighted interests of equipment vendors and a misunderstanding of the benefits to be gained from a standard interface.
“Stretchy battery” for wearables. Researchers at Stanford University have developed a stretchy battery useful for wearable electronics. The battery can be stretched to twice its original length without any power loss. The polymers in lithium-ion batteries that conduct negative ions toward the battery’s positive pole are in the form of gels housed in a rigid casing. By providing a power source that could stretch and bend, wearable electronics can be more comfortable. (IEEC file #11547, Electronics Weekly, 1/29/20)
SigmaTron has operations in the US, Mexico, China and Vietnam. As a result, we had a bird’s-eye view of the initial impact on manufacturing operations in China and used that as a roadmap for preparing operations in other locations for disruption, along with best in-plant practices for disease mitigation. While the ways different jurisdictions reacted to Covid-19 varied, the issues were somewhat similar. This column looks at some lessons learned in that process from this contract manufacturer’s perspective.
There was a four-to-eight week gap in component supplies from China due to the national shutdown in late January/early February. But, the combination of inventory produced/stored in anticipation of the normal Lunar New Year shutdown, combined with decreased demand as the virus disrupted production outside of China, enabled most China component manufacturers to catch up. Consequently, the shortages present in previous unanticipated supply disruptions were not as severe this time. That said, some spot shortages are developing as the US Defense Production Act constrains components needed for essential products such as ventilators.
The one steadfast rule all PCB manufacturing facilities hold dear is “we don’t guess.” Never. Break that rule and the consequences will bite back hard. To ensure no one is guessing, every question must be answered. If you failed to specify a tolerance on a set of holes, the job will go on temporary hold until the CAM operator can get a suitable answer. If you have an electrical short between ground power layers due to a misplaced via, the job goes back to sales to sort out. When a job is on hold for a serious problem, the result can be days of delay. If there are one or two small issues, however, in many instances the CAM operator or sales will call and sort it out. They might be able to move a trace or two to prevent a short, for example, or change a pad size to correct a problem with an annual ring that is too small. However, the CAM operator must meet a quota of jobs each day to keep the manufacturing facility fully loaded. They do not have an abundance of time to fix a multitude of problems in an individual customer’s data. Other jobs are waiting! In that case, the CAM operator hands the file back to sales to reject the data. The customer can then fix it and resubmit it through the whole process of price quote, DRC (design rule check) and setup.
Day 2: Met with the crew. Game plan time. Henceforth, the old guys (the “over 60s”) will stay home. That includes (gulp) me. Aging and mortality in one poignant bite. A small crew will remain at our facility, handling day-to-day essential business. (In the preceding 24 hours, we established our corporate essential bonafides.) Headcount will fluctuate daily, depending on happenings. Some will stay home today; others will do likewise tomorrow. I stay home every day pondering the Darwinian way of the world, and my humbling new lot in life as a high medical risk individual. Regardless of work site, all employees will continue to be paid for the foreseeable future. As if we can foresee it. No one will burn PTO if they must stay home. Engineering work will be conducted from home to the extent possible. No onsite customer visits will be allowed until further notice. Living a paradox: keeping it all together, while dispersed. Here we are.
Figure 1 shows the lead to be floating in the solder joint, suggesting poor wetting. When we examine the component lead and plastic body, however, the lead is not parallel, so it always sits off the pad surface, even if perfectly soldered. The lead sits in a cavity in the component body to maintain its position. But with the size of the pad used in the design and a full solder paste print, the component body will always lift.
To improve the component, the position of the pin should be parallel with the body. Ideally the opening of the body of the lead should be wider or angled to permit solder to wet without lifting the part. A simple shop-floor fix is to order another stencil and reduce the width of the paste print, decreasing the lift during reflow.













Authors: Kwon-Hyung Lee, Seong-Sun Lee, et al.
Abstract: Microsupercapacitors (MSCs) have garnered considerable attention as a promising power source for microelectronics and miniaturized portable/wearable devices. However, their practical application has been hindered by the manufacturing complexity and dimensional limits. The authors developed a new class of ultra-high areal number density solid-state MSCs (UHD SS–MSCs) on a chip via electrohydrodynamic (EHD) jet printing. This is, to the best of their knowledge, the first study to exploit EHD jet printing in MSCs. The activated carbon-based electrode inks are EHD jet-printed, creating interdigitated electrodes with fine feature sizes. Subsequently, a drying-free, ultraviolet-cured solid-state gel electrolyte is introduced to ensure electrochemical isolation between the SS–MSCs, enabling dense SS–MSC integration with on-demand (in-series/in-parallel) cell connection on a chip. The resulting on-chip UHD SS–MSCs exhibit exceptional areal number density [36 unit cells integrated on a chip (area = 8.0mm x 8.2mm), 54.9 cells cm−2] and areal operating voltage (65.9V cm−2). (Science Advances, Mar. 6, 2020, advances.sciencemag.org/content/6/10/eaaz1692)

