Printed Circuit Design & Fab Circuits Assembly March 2021 Cover
March 2021
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March 2021 • VOL. 38 • NO. 3
Printed Circuit Design and Fab Circuits Assembly logo
First Person
6
Good government.
Mike Buetow
money matters
15
Solving the age-old dilemma between design and manufacturing.
Peter Bigelow
16
Bringing PCB manufacturing back is easier said than done.
Greg Papandrew
Tech Talk
17
Assembly quality is found in the design as well as the process.
John Burkhert, Jr.
19
A smart way to patch things up.
Alun Morgan
22
Power integrity analysis assumptions.
Terry Jernberg
24
Just because something can be done doesn’t mean that it should be done.
Bill Hargin
41
Needed: Methods to best predict and adjust to demand spikes.
John Sheehan
42
Watch those catchphrases!
Robert Boguski
44
Dewetting on the surface of solder mask or components in manufacture.
Bob Willis
Departments
March 2021 • VOL. 38 • NO. 3
Printed Circuit Design and Fab Circuits Assembly logo
Features
Printed Circuit Design & Fab Circuits Assembly March 2021 Cover
28
High-Frequency Electronics
Applications for millimeter-wave (mmWave) circuits are growing rapidly, from collision-avoidance radar systems in autonomous vehicles to high-data-rate fifth generation (g5G) new radio (NR) cellular wireless networks. Many such applications are driving higher frequencies, above 24GHz, where wavelengths are smaller and the smallest attention to circuit design and fabrication can make the biggest differences in electronic product performance. Understanding the differences between PCBs at mmWave frequencies and lower frequencies can help avoid circuit manufacturing mishaps for many applications that are soon to require millions of double-sided and multilayer PCBs at those higher frequencies.
by John Coonrod
36
Outlook
One year in, has Covid-19 shifted priorities in the industry? To find out, we reached out in January to experts for insights on how the pandemic has impacted everything from inside the factory to the business decisions we make.
by Chelsey Drysdale
IN the Digital Edition
PCEA in the rearview mirror.
by KELLY DACK
The new data transfer format provides comprehensive support for embedded components.
by Chris Shaw
After years of observing well-intentioned but ultimately futile attempts to rebalance the industry, a new nonprofit is zealously lobbying the Defense Department for funding research – and getting it.
by Mike Buetow
Updates in silicon and electronics technology.
by Binghamton University
ON PCB CHAT (pcbchat.com)
Stackup Tools
with Keshav Amla and Tarun Amla
Flex Circuits and Additive Electronics
with Tara Dunn
The IPC Apex Tech Conference
with Matt Kelly
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Editor in chief
Mike Buetow, 617-327-4702, mbuetow@upmediagroup.com

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PCD&F CONTRIBUTING EDITORS
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Circuits Assembly CONTRIBUTING EDITORS AND ADVISORS
Clive Ashmore, David Bernard, Robert Boguski, John D. Borneman, Joseph Fama, Susan Mucha, Chrys Shea, Jan Vardaman, Ranko Vujosevic

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Caveat Lector
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mike
buetow
editor-
in-chief
An Electronics Holiday?
W

hat do you do when the very thing for which you’ve been asking, nay, begging for years actually materializes?

That would be US government support for the printed circuit board industry. And it’s coming in the form of real dollars, not just platitudes.

As we report in our digital edition this month, the US Partnership for Assured Electronics (USPAE), a subsidiary IPC formed last year to give it room to lobby on behalf of US members without running afoul of its international cohort, has as of late January garnered more than $42 million in taxpayer dollars to manage joint industry-academia programs to tackle electronics-related challenges.

How we’ve waited for this.

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Around the World
PCDF People
3D Systems named Mike Fitts regional sales manager.
Frontline PCB Solutions named Lior Furman product manager – business development.
Ohmega Technologies named Lisa Wilhelm director of sales. She joins from TTM Technologies, where she held positions in sales, engineering and program management.
Orbotech named Avi Greenberg general manager Americas and vice president sales.
Pioneer Circuits named Kevin Schuld staff quality engineer.
PCDF Briefs
A furnace explosion at AGC’s glass substrate manufacturing plant in Gumi, South Korea, injured nine workers and disrupted the TFT-LCD glass substrate supply chain.

AMD expects the number of notebook designs powered by its new generation of Ryzen mobile processors to grow 50% compared to its previous chips.

Around the World
New Dates Announced for PCB East
PCB EAST 2021 Conference & Exhibition
PCB EAST 2021 Conference & Exhibition
New Dates Announced for PCB East
ATLANTA, GA – UP Media Group announced new dates for PCB East when it returns to the Boston area this year. The three-day technical conference now takes place Jun. 15-17 in Marlborough, MA. The event includes a one-day exhibition on Jun. 16.

“As the Covid-19 vaccine rollout continues, we felt the best course of action was to adjust our dates accordingly, so the largest number of PCB industry professionals would be able to attend,” said Mike Buetow, conference director. “At this time, Mass-achusetts is scheduled to begin vaccinating the general population in April, and the adjacent states are planning similar schedules. Mid-June looks to be a safe time to at long last return to face-to-face interaction.”

Registration for the event is now open. Visit pcbeast.com for details. (MB)

Around the World
IPC Releases Standards for BTC Design, Digital Twins
BANNOCKBURN, IL – IPC in February announced the release of a revision to its standard for design and assembly for implementing BTCs. IPC-7093A, Design and Assembly Process Implementation for Bottom Termination Components (BTCs) is a complete overhaul and focuses on critical design, materials, assembly, inspection, repair, quality, and reliability issues, the trade group said.

IPC-7093A includes a step-by-step process on how to design and incorporate BTCs into any card layout. Comprehensive descriptions on how to implement robust designs and assembly processes and troubleshooting guidance for common anomalies that can occur during BTC assembly are included.

Around the World
Ticer Acquires Deposition Manufacturing Assets of Global Firm
CHANDLER, AZ – Ticer Technologies has completed the acquisition of manufacturing assets from another global manufacturing corporation for an undisclosed sum. Ticer is now operating the vacuum deposition/sputtering production equipment.

All processes, equipment and raw materials will continue to be the same during the ownership transition, and Ticer’s thin-film resistor copper foil products will remain unchanged.

“As we begin 2021, Ticer Technologies is pleased to be in a stronger position technically, have greater flexibility and expanded capacity for volume business growth. We are looking forward to offering our expanded benefits to our global customer base,” said David Burgess, president, Ticer. (CD)

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Around the World
CA People
Altus Group promoted Joe Booth to chief executive.
Anwarson Advanced Research Projects Laboratory named Hassan Shahzad chief technology officer.
ASM Pacific Technology named Waldemar Christen vice president CRM, SMT Solutions.
Datalink Electronics named Shane Nooney SMT engineer.
Ducommun appointed Christopher D. Wampler CFO, controller and treasurer.
Tara Fischer Headshot
ECD co-owner Tara Fischer is now exclusive owner and president. She has been with the company 26 years.
Europlacer named François Erceau group strategic direction and marketing officer.
4Front Solutions named Anthony Jepson chief operating officer.
Around the World
National Circuit Assembly Merges with Austin Circuit Design
GARLAND, TX – National Circuit Assembly announced on Feb. 16 a merger with Austin Circuit Design, adding design and sourcing to its electronics manufacturing services. Financial and other terms were not disclosed.

NCA was founded by Mike Tieu in 2006. It operates a 30,000 sq. ft. factory northeast of Dallas.

ACD was founded as Circuit Design Consultants by Greg Ochoa in 1985. It incorporated and became Austin Circuit Design in 2002. The firm was sold to its current ownership in 2015.

Around the World
AEM Holdings Proposes Acquisition of CEI for $75M
SINGAPORE – Electronics manufacturing company AEM Holdings has launched a S$99.7 million (US$75.2 million) bid for contract manufacturer CEI. AEM plans to delist CEI from the Singapore Exchange and take it private.

AEM is offering S$1.15 in cash, or a mix of cash and new AEM shares, for each ordinary share in mainboard-listed CEI.

CEI shareholders can opt to accept the offer for either 85% cash and 15% new shares or 70% cash and 30% new shares at an issue price of S$3.55 for each new share in AEM.

Founded in 1999, CEI has annual revenues of about $100 million primarily from customers in the industrial equipment market. It operates sites in Singapore, Indonesia and Vietnam. (CD)

Around the World
Motorola Opening Video Security Manufacturing Plant in TX
RICHARDSON, TX – Motorola Solutions is opening a 136,000 sq. ft. Video Security and Analytics manufacturing facility here. The new site consolidates smaller manufacturing facilities from Allen, Plano and Carrollton, TX, and will serve as the manufacturing hub for at least six companies.

The new facility is expected to ship nearly 400,000 cameras and produce one million PCBAs in 2021. It will employ some 250 staff, with expected growth to 300.

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Around the World
CA Briefs
ACDi purchased a Juki FX-3L SMT line and a Nordson Dage Assure x-ray component counter.

Amazon is setting up its first device manufacturing line in India to make Fire TV sticks and is partnering with Cloud Network Technologies, a subsidiary of Foxconn.

BEST Inc. installed an ERSA IR/PL 550 BGA rework system.

Circuit Technology Center purchased an SCS Ionograph BTSP series ionic cleanliness tester.

Cogent Technology increased the size of its Suffolk, England, EMS plant by more than 60,000 sq. ft., to 80,000 sq. ft. overall.

Cogiscan announced a strategic long-term partnership with Vayo Technology.

Continental plans to open a $170 million auto electronics factory in northern Serbia.

Dymax added Electronic Assembly Products as channel partner in North America.

Eriez completed a 38,000 sq. ft. expansion to its manufacturing plant in Erie, PA, including a new electronics lab, and a software and circuit board development area.

ExcelTech purchased a Nordson YesTech FX-940 3D Ultra AOI.

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Market Watch
EDITED by CHELSEY DRYSDALE
XBOXED OUT

Trends in the U.S. electronics equipment market (shipments only)

%CHANGE
OCT.
NOV.
DEC.
YTD%
Computers and electronics products
2.3
-1.5
0.6
4.5
Computers
1.7
-0.5
-3.4
-6.6
Storage devices
17.7
-1.8
0.0
24.7
Other peripheral equipment
2.1
3.1
-6.2
9.3
Nondefense communications equipment
10.7
-7.4
3.4
13.6
Defense communications equipment
0.0
8.7
-11.3
7.3
A/V equipment
1.4
-3.8
-12.9
-2.2
Components1
1.5
0.7
-1.0
10.4
Nondefense search and navigation equipment
2.4
-1.2
-0.9
-5.0
Defense search and navigation equipment
0.7
-2.2
0.2
2.2
Medical, measurement and control
1.7
-0.5
1.0
0.3
rRevised. *Preliminary. 1Includes semiconductors. Seasonally adjusted.
Source: U.S. Department of Commerce Census Bureau, Feb. 4, 2021
Uyemura International Corporation Clear Signals
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ROI
When What You Want Isn’t What You Need
Solving the age-old dilemma between design and manufacturing.
Developing a new product or process – or even aggressively refining them – is a juggle of “wants” and “needs.” As manufacturers in an industry that constantly pushes the envelopes of performance, real estate, and – yes! – cost, our industry is precisely where the rubber meets the road in reconciling needs and wants.

Manufacturing is a curious profession that often relies on older equipment, processes and employee skills to produce cutting-edge “new” products. The catalyst is, of course, people: people who design and people who take those designs and make functioning product. As smart, talented, dedicated and thoughtful as these people may be, however, they often fail to communicate the needs vs. the wants.

BOARD BUYING
Bringing PCB Manufacturing Back is Easier Said Than Done
Government incentives are just part of the formula.
Government-led directives of late are aimed squarely at bringing manufacturing back to the US. President Biden recently signed an executive order requiring the federal government to buy more goods produced in the United States and limiting the ability of federal agencies to issue waivers on overseas purchases.

Earlier, President Trump had approved regulations that increased the share of a product’s components that must be produced domestically to qualify as US-made. He also imposed a 25% tariff on goods imported from China.

The $740 billion 2021 National Defense Authorization Act (NDAA), which took effect in January, includes a provision forbidding the purchase by the Department of Defense of printed circuit boards manufactured in potentially adversarial countries such as China, Russia, North Korea and Iran. Many in our industry have welcomed this new directive as a means of rebuilding the once-robust PCB manufacturing climate in the United States. But shoring up the domestic PCB industry will require much more.

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designer’s notebook
Solderability is More than Selecting the Right Solder
Quality is found in the design as well as the process.
Solder defects are inevitable. Reducing their risk is mandatory, especially if you’re aiming to make money as a result of operations. Machines are certainly not “almost human,” but they do go through seasonal changes and have moods. Without proper upkeep, they fall into disrepair. The goal in assembly is to dial in the thermal profile of the soldering equipment to minimize solder defects.

Footprint model accuracy is an enabler, but that work can be undone by improper routing and copper-flooding techniques. Placement too near the edge of the board where the temperature fluctuates to a greater degree can decrease yields through the soldering process. Tombstoning is one thing to watch for, but other dangers are present on the frontier.

The DIGITAL Route
Footprints: Small Steps with a Giant Impact
Musings on land patterns and moon landings.
In this month’s column, I celebrate the importance of the humble PCB component footprint. I suggest that creating and leaving positive professional footprints on all we do in the Printed Circuit Engineering Association is imperative to the success of our industry. Next, I hand it off to PCEA Chairman Steph Chavez for some inspiring words as we tread into the new year. And as always, I provide a list of events coming up.
PCEA Updates
Not a day goes by that I don’t come across hundreds of footprints. Not all are related to electronic components used in PCB design. Around a cattle ranch, for instance, some are left by turkeys, deer, cattle and other outdoor critters as they go about their daily business foraging for food in the snow. Some footprints are my own, which I make as I go about my daily business taking care of outside chores. Sometimes I make “bad” footprints, tracking them into the kitchen if I fail to shed my Muck Boots in the mud room before entering. These are hardly lasting footprints, as I’d like to point out. They are made without much thought and quickly fade with the next snowfall or the wipe of a mop across the floor.
material gains
Wearable Technology is Looking Good
For real-time and predictive interventions, smart patches are in style.
For many of us in the technology sector, markets for high-tech products have remained resilient in the face of the effects of the pandemic. Despite lockdowns and restrictions, businesses are finding innovative ways to continue operating safely. Indeed, some seem to be thriving.

Gartner predicts the wearables market will grow 18% in 2021, reaching $81.5 billion. Ear-worn devices represent almost 50% of this market, with the current strong sales attributed to the WFH trend – as people upgrade from standard headphones for video conferencing – and the latest smartphones that have no 3.5mm jack.

Gartner notes, however, the increasing contribution of smart patches in the wearables space, rising to third in importance as sales of wristbands decline. This technology has ample potential to realize innovations in fields such as medicine and wellbeing that are so far undiscovered.

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PI
The Rise of Power Integrity Analysis for Designers
Assumptions made in simulation may not reflect live board conditions.
As simulation and analysis continue to mature, the evolution is from a mechanism for finding problems to a methodology for preventing them. Many design teams have advanced beyond checking for violations and now use the tools to make informed design decisions early in product development. This results in better products reaching production floors despite condensed schedules.
material matters
Winning the War against Analysis Paralysis
The “founder” of TMI asks, How much is more analysis worth?
Just because something can be done doesn’t mean that it should be done.

A few customer encounters this past month caused an issue to ricochet around in my mind like a 1970s pinball machine. I’m referring to a trap we’ve all fallen into: analysis paralysis.

Three interrelated definitions I have for analysis paralysis are worth enumerating:

  1. The condition of being indecisive while overanalyzing alternatives. (Classic analysis paralysis.)
  2. Allowing a project to mushroom into something bigger than it needs to be to get the job done. (This column is a good example.)
  3. Using data from the most expensive tools you own just because you have the tools or the data (e.g., it’s expensive and took a lot of time, so it must be good).

It’s not that analysis or expensive tools aren’t good, but their employment is an optimization process.

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data transfer
Getting Embedded with IPC-2581C
The new data transfer format provides comprehensive support for embedded components. by CHRIS SHAW
Board designers today must provide fabricators files beyond those containing the design data in order to describe what is needed for embedded components. It’s a nonstandard process, different for each designer-fabricator relationship, so every fabricator must contend with multiple, disparate, nonintelligent formats and communications. Sometimes the additional files get out of sync with the design data, thus requiring phone calls or more revisions of the files to sync up what is intended. This is a slow, manual and error-prone process, which is still used even with other intelligent data transfer formats.

An additional challenge is that while some ECAD tools may now support state-of-the-art embedded components – e.g., face-up (flipped), pins on both top and bottom, formed (etched, printed) – the handoff to manufacturing formats has not evolved to support them at the same pace.

High-Frequency Electronics
PCB Design and Fabrication Concerns for Millimeter-Wave Circuits
Essential for mmWave applications, phase accuracy is affected by a host of variables. by JOHN COONROD

Applications for millimeter-wave (mmWave) circuits are growing rapidly, from collision-avoidance radar systems in autonomous vehicles to high-data-rate fifth generation (g5G) new radio (NR) cellular wireless networks. Many such applications are driving higher frequencies, above 24GHz, where wavelengths are smaller and the smallest attention to circuit design and fabrication can make the biggest differences in electronic product performance. Understanding the differences between PCBs at mmWave frequencies and lower frequencies can help avoid circuit manufacturing mishaps for many applications that are soon to require millions of double-sided and multilayer PCBs at those higher frequencies.

RF PCB Technologies Overview

Compared to lower frequency circuits, high-frequency RF/microwave circuits are sensitive to circuit materials and fabrication processes. Whereas some electrical circuit functions such as power lines and digital control may be well-supported with low-cost FR-4 circuit materials, RF, microwave and mmWave circuits require much higher performance circuit materials to minimize signal losses and distortion. Many multilayer mixed-signal PCBs with many different electrical functions are a blend of different types of circuit substrate materials, with materials selected according to behavior best suited for the types of circuit functions fabricated on that layer.

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USPAE
US Defense Suppliers Have Begged for Help. A Pandemic Helped Them Get It
How a new trade group is aiding the DoD’s desire for a trusted supply chain. by MIKE BUETOW

For decades the printed circuit industry has asserted the lack of government support has a deleterious effect on the supply chain’s ability to properly supply the US military. Attempts to correct this over the years have been numerous but largely unsuccessful.

Led by IPC, industry has lobbied the US Congress since the early 1990s to reduce barriers to winning military contracts, and, as margins were slashed beginning in the early 2000s, to fund research and development that could be shared among Defense Department suppliers to help their competitiveness.

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outlook
2021: Automation, Flexibility and the ‘Electronics Supercycle’
One year in, Covid-19 has shifted priorities in the industry – or has it? by CHELSEY DRYSDALE
One year in, has Covid-19 shifted priorities in the industry? To find out, CIRCUITS ASSEMBLY reached out in January to experts for insights on how the pandemic has impacted everything from inside the factory to the business decisions we make. Then, for good measure, we asked how the semiconductor industry might change in the wake of Intel’s proposed sale of some manufacturing assets, a move that could have lasting impacts on the IC. We spoke with a range of leaders covering various segments of the electronics manufacturing supply chain. Their responses, lightly edited for clarity and length, follow. After reading their thoughts, share your own on our LinkedIn page (https://www.linkedin.com/groups/2847418/).

CA: In the wake of Covid-19, have factory qualification procedures changed? If so, how?

Ryan Hagemeier (director quality and product regulatory assurance, Plexus): Overall, audit/inspection criteria have not changed. However, regulatory authorities, notified bodies and even our customers have had to modify their approach given the current limitations for traditional onsite inspections, including: extending certifications to allow revised audit scheduling, performing remote audits/inspections, and leveraging other regulatory authority inspection/documentation history to focus on performing higher-risk inspections in the short term.

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GETTING LEAN
Materials Environment Drives New Challenges
Needed: Methods to best predict and adjust to demand spikes.

ANY SUPPLY CHAIN management executive will likely tell you that 2021 is 2020 on steroids. Reason: While 2020 had supply-chain disruption, the worst part of that disruption was followed by drops in customer demand due to Covid-19-related lockdowns, so the situation never worsened beyond spot shortages or transportation delays. This year, pent-up consumer demand combined with historic low interest rates supporting consumer spending is spiking product demand in multiple industries as consumers make purchases they delayed in 2020. 5G infrastructure is rolling out, demand has increased for electric vehicles, which have substantially more electronic components per car, and Covid-19 continues to drive higher medical equipment production. As a result, demand variations are changing schedules weekly. At the same time, constraints developing in the materials market are driving higher prices and longer lead-times. Transportation and freight resources are stretched, and pricing and lead-times are increasing. Covid-19 continues to cause some level of disruption as hot zones develop around the world. In short, 2021 will be a year where multiple variables are constantly in flux.

IEEC
State-of-the-Art Technology Flashes
Updates in silicon and electronics technology.
Ed.: This is a special feature courtesy of Binghamton University.
Breakthrough quantum-dot transistors create a flexible alternative to conventional electronics. Researchers at Los Alamos National Laboratory have created fundamental electronic building blocks out of tiny structures known as quantum dots and used them to assemble functional logic circuits. This development provides a low-cost and manufacturing-friendly approach to complex electronic devices. The building blocks can be fabricated in a laboratory with simple, solution-based techniques, and provide these components for a host of innovative devices. Potential applications of the new approach to electronic devices based on non-toxic quantum dots include printable circuits, flexible displays, lab-on-a-chip, wearable devices, medical testing, smart implants, and biometrics. (IEEC file #11971, Science Daily, 10/29/20)

This flexible and rechargeable battery is 10 times more powerful than state-of-the-art. University of California researchers working with ZPower have developed a flexible, rechargeable silver oxide-zinc battery that provides five to 10 times greater energy density than current state-of-the-art. The battery also is easier to manufacture, as it can be screen-printed in normal lab conditions. The areal capacity for this innovative battery is 50ma/cm2 at room temperature, which is 10 to 20 times greater than the areal capacity of a typical lithium-ion battery. The device can be used in flexible, stretchable electronics for wearables as well as soft robotics. (IEEC file #12027, Science Daily, 12/7/20)

Seeing is Believing
Hell Hath No Fury Like A Test Engineer Scorned
Or even mildly irritated. So watch those catchphrases.
AS WE MOVE into 2021, I resolve to renew my approach to doing business, call things as they really are, and exile all my peeves into permanent residence, where they belong, in their appropriate circle of Hell, apropos Dante Alighieri.

That’s right: we’re talking Inferno.
Flames have consequences.
Nine circles. Nine gripes. All therapy.
In ascending order of severity.
Here goes.

First Circle: Those who begin an email with the salutation “Hey.”

As in, “Hey Robert, our driver just dropped off 1,594 boards for flying probe testing.” No prior warning. “Can we come back in two hours to start picking them up?”

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defect of the month
PCB and Component Coating Dewetting
As-supplied component residues are often the culprit.
This month we look at dewetting on the surface of solder mask or components in manufacture.

FIGURES 1 and 2 show the impact of dewetting on the surface of plastic components in conformal coating. Figure 2 illustrates dewetting on solder mask. In both cases if the coating does not cover all the critical areas of the assembly, it must be reworked. It is up to the quality and design departments to agree what level, if any, of dewetting is acceptable to the product and the customer, rather than just quoting a standard. In some cases, the position or level of the problem may not affect the product operation or reliability.

Off The Shelf
off the shelf typography
Machines Materials Tools Systems Software
Pulsonix version 11.0 offering significant speed improvements
Pulsonix v. 11.0
Pulsonix version 11.0 offers significant speed improvements and new functionality for high-speed designs. Dramatically reduces time to perform many PCB design operations, such as DRC, copper pouring and Gerber generation. Complete rewrite of underlying graphics engine displays some large designs up to 2.5 times faster. Extends multi-threading capabilities.
Pulsonix
MCL-HS200 advanced functional laminate
Hitachi Chemical MCL-HS200
MCL-HS200 advanced functional laminate features low polarity resin materials and low dielectric glass cloth for low transmission loss and warpage. CTE is 10 ppm/°C and dielectric constant (Dk) is 3.4 @10GHz. For 5G, ADAS, and AI.
Hitachi Chemical
Speedstack 21_02 stackup tool
Polar Instruments Speedstack 21_02
Speedstack 21_02 stackup tool supports a new shield material type, allowing addition of shielding materials for rigid and flex PCB constructions. Exports/imports shield library data via third-party tools like Excel. Includes stackup editor enhancements: shield material options to add, delete, swap, move up, move down, symmetry and set properties. Impedance and insertion calculations support new shield material type.
Polar Instruments
Off The Shelf
off the shelf typography
Machines Materials Tools Systems Software
18KLF solder recovery system
EVS 18KLF
18KLF solder recovery system has a 40lb pot. Recovers up to 80% of pure solder. Has touchscreen display and is automatic. Provides clean ingot bar as it filters solder through gauze. Includes sealed cabinet, enclosing dross bucket and fume extraction. Has tilting pot mechanism. Inverting and rotating dross/solder pot and hot-air-activated auto drain tap create solder ingots. ISO14001 compatible.
EVS International
XQuik II Plus component counter
VJE XQuik II Plus
XQuik II Plus component counter has less than 20 sec. cycle time for single reel and quad counts. AI detection algorithms automatically recognize components. Automatically determines whether up to four small reels are loaded and keeps track of reel location. Built-in barcode reader eliminates extra manual scanning steps.
VJ Electronix
SC-BP3 multi-purpose bubbling cleaning system
Sawa SC-BP3
SC-BP3 multi-purpose bubbling cleaning system reportedly cleans flux five times faster than immersion cleaning. Uses air valve in place of electricity. Bubble washer features tank large enough to clean 10 pallets simultaneously. Removes flux by soaking parts. Bubble washing system includes rinse and drying units for cleansing/rinse/drying in 20 to 30 min. Pica solvent is safe and odor-free with no flame point, sustainable and eco-friendly. Can be used with other low-VOC and water-based cleaning solutions.
Sawa
Seika Machinery
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Technical Abstracts
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Carbon-Based Conductors
“Fast Response Organic Supramolecular Transistors Utilizing In-Situ π-Ion Gels”

Authors: Soh Kushida, et al.

Abstract: Organic electrochemical transistors (OECTs) are transistors that involve electrochemical doping. Although the device configuration of OECTs is identical to that of electrolyte-gate OFETs, the principal mechanism differs fundamentally. Once a gate bias is applied, ions pass through the boundary and penetrate the active layer. As a result, the whole layer is electrochemically doped, gaining a volumetric current through the full 3-D channel. In this paper, the authors present a new class of supramolecular transistors, named π-ion gel transistors (PIGTs), that employ an in situ π-ion gel as an active layer, as well as an internal gate capacitor. PIGTs exhibit a large transconductance of 133µS, retaining a hole carrier mobility (4.2 × 10−2cm2 V−1 s−1) and an on/off ratio (≈3.7 × 104) comparable to those of supramolecular devices. Due to the unique device structure, PIGT shows a response time of <20µs, the fastest time among accumulation-mode electrochemica-based transistors ever reported. (Advanced Materials, December 2020; https://onlinelibrary.wiley.com/doi/10.1002/adma.202006061)

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