Technical Abstracts
In Case You Missed It
Component Assurance
“Assurance: A Data Driven Approach”

Authors: Richard Ott, Ph.D.

Abstract: The push toward globalization, combined with the proliferation of commercial and consumer products containing ICs, has led to rapid semiconductor business growth in Asia. ICs specifically produced for military applications make up a small percent of the total market, ranging from 0.1 to 1%. Due to low-volume requirements, the military is not capable of meaningful influence, resulting in a larger disparity between commercial and military requirements. Most IC fabrication and considerable intellectual property design is performed overseas, while domestic, trusted foundry options are often two to three process nodes (three to eight years) behind state-of-the-art (SOTA), with 50% higher cost. To take advantage of SOTA technologies, US military systems are forced to utilize commercially available supply chains. Offshore design, production, and independent distribution of ICs provide adversarial opportunity for malicious insertion and component counterfeiting, motivated by strategic objectives or economic gain. To combat this, while maintaining access to SOTA technologies, the US military must develop an approach to minimize platform and infrastructure risk, enabling cutting-edge capability to be delivered to the war fighter. Data-driven assurance methods provide an opportunity to deliver such capability, along with an understanding of associated risk. (SMTA Symposium on Counterfeit Parts and Materials, August 2020)

Electronic Materials
“Moisture-Insensitive, Self-Powered Paper-Based Flexible Electronics”

Author: Marina Sala de Medeiros, Daniela Chanci and Ramses V. Martinez, Ph.D.

Abstract: The fabrication of multifunctional electronic devices on ubiquitous paper substrates is gaining considerable attention due to their low cost, environmental friendliness, light weight, and flexibility. Development of paper-based electronics is subject to significant challenges, such as rapid degradation with moisture, battery dependence, and limited compatibility with existing mass-production technologies. This work describes omniphobic, self-powered paper-based electronics (RF-SPEs), completely wireless paper-based electronic devices insensitive to moisture, liquid stains, and dust. RF-SPEs can be rapidly fabricated through the sequential spray-deposition of alkylated organosilanes, conductive nanoparticles, polytetrafluoroethylene (strong electron affinity), and ethyl cellulose (weak electron affinity) over the surface of cellulose paper. RF-SPEs are lightweight, inexpensive to print (<$0.25 per device), and capable of generating power densities up to 300µW/cm2. Additionally, RF-SPEs are flexible and exhibit excellent stability upon folding (0.3mm radius of curvature). The simple printing process and relative low cost of RF-SPEs enable the large-scale production of self-powered, paper-based electronics toward the ubiquitous integration of human-machine interfaces. (Nano Energy, August 2020, https://doi.org/10.1016/j.nanoen.2020.105301)

Thermal Management
“Co-Designing Electronics with Microfluidics for More Sustainable Cooling”

Authors: R. van Erp, R. Soleimanzadeh and L. Nela, et al.

Abstract: Embedding liquid cooling directly inside the chip is a promising approach for more efficient thermal management. However, even in state-of-the-art approaches, the electronics and cooling are treated separately, leaving the full energy-saving potential of embedded cooling untapped. Here, the authors show that codesigning microfluidics and electronics within the same semiconductor substrate can produce a monolithically integrated manifold microchannel cooling structure with efficiency beyond what is currently available. The results show heat fluxes exceeding 1.7kW/sq. cm. can be extracted using only 0.57W/sq. cm. of pumping power. They observed an unprecedented coefficient of performance (exceeding 10,000) for single-phase water-cooling of heat fluxes exceeding 1kW/sq. cm., corresponding to a 50-fold increase compared to straight microchannels, as well as a high average Nusselt number of 16. The proposed cooling technology should enable further miniaturization of electronics, potentially extending Moore’s law and greatly reducing the energy consumption in cooling of electronics. Furthermore, by removing the need for large external heat sinks, this approach should enable the realization of very compact power converters integrated on a single chip. (Nature, September 2020, https://doi.org/10.1038/s41586-020-2666-1)

This column provides abstracts from recent industry conferences and company white papers. Our goal is to provide an added opportunity for readers to keep abreast of technology and business trends.